Samsung SDC-33 Specifiche

DIGITAL STILL CAMERASDC-30SDC-33SERVICE POWERMODETIMERDELETE1. Precautions2. Reference Information3. Product Specifications4. Disassembly and Reassemb

Reference InformationSamsung Electronics 2-72-1-6 Sytem controlDual controller (MICOM) is located in DSC : A RISC chip controls the signal processing,

Reference Information2-8 Samsung Electronics- Mode change: When the mode is input by the PC key (or main body), 4-bit MICOM signals the RISC. When the

Reference InformationSamsung Electronics 2-92-2 IC Blocks2-2-1 IC301 (SMA9606)

Reference Information2-10 Samsung Electronics2-2-2 IC302 (KM416C256BLT)

Reference InformationSamsung Electronics 2-112-2-3 IC304 (HD6477043)

Reference Information2-12 Samsung Electronics2-2-4 IC307 (TC5832FT)

Reference InformationSamsung Electronics 2-132-2-5 IC601 (UPD75P3116GC)2-2-6 IC501 (MAX232C)

Reference Information2-14 Samsung Electronics2-2-7 IC203 (NN2038FAQ)

Reference InformationSamsung Electronics 2-152-2-8 IC204 (NN5248)

Reference Information2-16 Samsung ElectronicsMEMO

Samsung Electronics 1-11. Precautions1. Be sure that all of the built-in protective devices arereplaced. Restore any missing protective shields.2. Whe

Samsung Electronics 3-13. Product SpecificationsDesign and specifications are subject to change without notice.SDC-30

Product Specifications3-2 Samsung ElectronicsMEMO

Samsung Electronics 4-14. Disassembly and Reassembly4-1 Cabinet and PCB Disassemble in the order shown.(Reassemble in reverse order.)4-1-1 Case-Side R

Disassembly and Reassembly4-2 Samsung Electronics4-1-2 Door-Battery RemovalOpen the Door-Battery (in the direction of arrow), and twist it to remove.

Disassembly and ReassemblySamsung Electronics 4-34-1-4 Main-PCB RemovalRemove 2 screws.Disassemble MAIN PCB while disconnecting CN301 from FUNCTION-P

Disassembly and Reassembly4-4 Samsung Electronics4-1-6 Case-Top RemovalDisconnect one tab and detach Case-Top in the direction of arrow.14-1-7 Case-

Disassembly and ReassemblySamsung Electronics 4-54-1-8 OVF RemovalRemove 1 screw.Lift up OVF.12Note : Take extreme care not to ieave fingerprints o

Disassembly and Reassembly4-6 Samsung ElectronicsMEMO

Samsung Electronics 5-15. Alignment and AdjustmentsWARNING: The main board should be replaced if the back focus is twisted.Note : Ther is no need to a

Alignment and Adjustments5-2 Samsung Electronics5-2-3 Program installation* Perform setup.exe.* Perform SVC.exe (use directory made by setup.exe).5-2-

Precautions1-2 Samsung Electronics11. High voltage is maintained within specified limitsby close-tolerance, safety-related components andadjustments.

Alignment and AdjustmentsSamsung Electronics 5-3Select 'SDC-33/30' of Winows menu bar inuse of mouse.Two items appear as shown in Fig. 5-5.S

Alignment and Adjustments5-4 Samsung ElectronicsCommunication port settingCommunication rate settingAdjustment settingOK button Fig. 5-7 Option window

Alignment and AdjustmentsSamsung Electronics 5-54) Execute the program in accordance with the sequence of Fig. 5-6.Fig. 5-9 Process and procedure of a

4, Adjistment item: Supply power to the entire camera: Check connections between DRAM and RISC: Check the flash memory state. The various information

Alignment and AdjustmentsSamsung Electronics 5-7LCD testMode testTimer testShot and DisplayPower interrupt: Check each segment of camera LCD screen.

Alignment and Adjustments5-8 Samsung Electronics5. Process for adjustment failure* Communication port XX cannot be used. Select another port.-> Can

Alignment and AdjustmentsSamsung Electronics 5-95-2-5 Using the software1. Edit S/W installation and use (iPhoto express of Ulead company based)1) Ins

Alignment and Adjustments5-10 Samsung Electronics3. Twain driver preparationFig.5-161) Execute TWAIN compatible edit program (Photo Impect, Video Stud

Alignment and AdjustmentsSamsung Electronics 5-114. TWAIN driver useFig.5-17Brief descriptions for other functions (except image transmission function

Alignment and Adjustments5-12 Samsung ElectronicsMEMO

2. Reference Information2-1 Circuit description2-1-1 DSCDigital camera(SDC-30/33), is an image-input device that connects to a PC. It’s small and ligh

Samsung Electronics 6-16. Troubleshooting

Troubleshooting6-2 Samsung Electronics

TroubleshootingSamsung Electronics 6-3

Troubleshooting6-4 Samsung Electronics

TroubleshootingSamsung Electronics 6-5

Troubleshooting6-6 Samsung ElectronicsSelect 'SDC33/30' of Winows menu bar inuse of mouse.Two items appear as shown in Fig.6-2.Select '

TroubleshootingSamsung Electronics 6-76-3 Test procedurePower supplyDRAM testMemory formatASIC testLCD testMode testTimer testShot & DisplayPower

Troubleshooting6-8 Samsung ElectronicsPower supplyDRAM testMemory formatASIC testLCD testMode testTimer testShot & DisplayPower interrupt: Supply

TroubleshootingSamsung Electronics 6-96-5. Follow up Actions After inspection* Communication port XX can't be used. Select another port.-> Can

Troubleshooting6-10 Samsung ElectronicsMEMO

Reference Information2-2 Samsung Electronics2. Camera powerCamera power block consists of IC120 (PWM IC MB3800), Q121 (INVERTER TR DTC144EU), Q122 (S

Samsung Electronics 7-17. Exploded View and Parts List7-1 Cabinet Assembly - - - - - - - - - - - - - - - - - - - - - - - 7-2 Accessory - - - -

Exploded View and Parts List7-2 Samsung Electronics7-1 Cabinet Assembly123457891011121314151617181920212230323030303131

1 AD59-10417A UNIT-CASE FRONT 2 AD64-20621A PANEL-FRONT;-,A5056P,T0.8,-,-,DSC33 OPTION AD64-20

Exploded View and Parts List7-4 Samsung Electronics7-2 Accessory1.5V1.5V1.5V1.5VUser ManualDO NOT ORDER213645AD91-10001A ASSY-ACCESSORY; SDC-30,NTS

16 AD90-10819W ASSY-MAIN BOARD;SDC-33 AD90-10812V ASSY-MAIN BOARD;SDC-30 C201 2203-000477 C-CERAMIC,CHIP;1UF,+80-20%

Electrical Parts List8-2Samsung ElectronicsC281 2203-001556 C-CERAMIC,CHIP;100NF,+80-20%,25V,Y5V,TP,1608, C282 2203-000626 C-CERAMIC,CHI

L201 2703-000403 INDUCTOR-SMD;22UH,10%,3.2X2.5X2.2MM L202 2703-000363 INDUCTOR-SMD;10UH,5%,2.5X2X1.8MM L203

R240 2007-000078 R-CHIP;1KOHM,5%,1/16W,DA,TP,1608 R242 2007-000093 R-CHIP;20KOHM,5%,1/16W,DA,TP,1608 R244

C122 2203-001556 C-CERAMIC,CHIP;100NF,+80-20%,25V,Y5V,TP,1608, C123 B1100-0674 C-CERAMIC,CHIP;CK 73 Y5V 16V T 685-Z C3225 C124

R105 2007-000060 R-CHIP;100KOHM,1%,1/16W,DA,TP,1608 R106 2007-000060 R-CHIP;100KOHM,1%,1/16W,DA,TP,1608 R107

Reference InformationSamsung Electronics 2-32. LensSDC-30/33 lens uses a fixed focus method, and can take a photograph clearly at over 1 meter distanc

14AD90-10813HASSY-FUNC BOARDC601 2404-000198 C-TA,CHIP;22UF,20%,6.3V,-,TP,3528,- C602 2203-001556 C-CERAMIC,CHIP;100NF,+80-20%

Electrical Parts List8-8Samsung ElectronicsMEMO

Samsung Electronics 9-19. Block Diagram

Samsung Electronics 10-110. PCB DiagramsPage10-210-210-310-1 Main - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 10-2 Jack -

PCB Diagrams10-2 Samsung Electronics10-1 Main LOCATIONCOORDINATESJ502 3-BJ501 2-BIC501 1-A1234ABCDEFLOCATIONCOORDINATESQ101 4-AQ122 3-BQ204 4-FIC10

PCB DiagramsSamsung Electronics10-310-3 FunctionLOCATIONCOORDINATESIC601 3-FCN602 4-F(Component Side) (Conductor Side)1234ABCDEFGH1234ABCDEFGHLOCAT

Samsung Electronics 11-111. Schematic DiagramsPage11-211-311-411-511-63 Block Identification of Main PCB - - - - - - - - - - - - - - - 11-1 DC/D

Schematic Diagrams11-2 Samsung ElectronicsFor schematic Diagram- Resistors are in ohms, 1/8W unless otherwise noted.- Circled numbers refer to wavefor

Schematic DiagramsSamsung Electronics 11-311-1. DC/DC

Schematic Diagrams11-4 Samsung Electronics11-2. Main1 2910311412513614715816DC/DCCN301CN206218765161415 3 4111291013ANALOG SIGNALDIGITAL SIGNALJPEG S

5. Timing Generator (MN5246)A timing generator generates each clock, synchronized signal, and CCD driving pulse for the system. Also, itreceives the s

Schematic DiagramsSamsung Electronics 11-511-3. Jack

Schematic Diagrams11-6 Samsung Electronics11-4. Function

Reference InformationSamsung Electronics 2-57. A/D converter (KAD0228) and DRAM Controller (SMA9606)A/D converter converts the analog signal which is

Reference Information2-6 Samsung Electronics2-1-5 Digital Section1. OverviewFig. 2-62. DRAM (KM416C256BLT) and flash memory (TC5832FT/TC5816FT)DRAM st