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General Information
DDR3 SDRAM
1. DDR3 SDRAM Component Ordering Information
1 2 3 4 5 6 7 8 9 10 11
K 4 B X X X X X X X - X X X X
SAMSUNG Memory
DRAM
DRAM Type
Density
Bit Organization
Speed
Temp & Power
Package Type
Revision
Interface (Vdd, Vddq)
# of Internal Banks
1. SAMSUNG Memory : K
2. DRAM : 4
3. DRAM Type
B :DDR3 SDRAM
4. Density
51 : 512Mb
1G : 1Gb
2G : 2Gb
4G : 4Gb
7. Interface ( Vdd, Vddq)
6 : SSTL (1.5V, 1.5V)
8. Revision
M
A
B
C
D
E
F
G
H
1st Gen.
2nd Gen.
3rd Gen.
4th Gen.
5th Gen.
6th Gen.
7th Gen
8th Gen
9th Gen
5. Bit Organization
6. # of Internal Banks
4 Banks
8 Banks
16 Banks
9. Package Type
Z
H
04 : x 4
J
08 : x 8
M
16 : x16
FBGA (Lead-free)
FBGA (Halogen-free & Lead-free)
FBGA (Lead-free, DDP)
FBGA (Halogen-free & Lead-free, DDP)
10. Temp & Power
C : Commercial Temp.i
L : Commercial Temp.i
Y : Commercial Temp.i
0°C ~ 85°C) & Normal Power
0°C ~ 85°C) & Low Power
0°C ~ 85°C) & Low VDD(1.35V)
11. Speed
F7
F8
H9
K0
DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)
DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
ELECTRONICS
October 2009
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